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Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo que no amarillea Acceso sencillo a todos que no amarillea El diseño arqueado de la parte posterior es cómodo y estable resistente al calor y a la deformación reduce la repetición del trabajo y aumenta la eficiencia del flujo de trabajo
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